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SLF385 two-component addition type potting glue

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brand: 白云

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热导率: 0.65w/m.k
混合比: 1:1
硬度: 65HSA
Unit Price: Negotiable
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Delivery: After payment in 3 days Ship out
Location: Global
Available: Long-term effectiveness
Last update: 2015-09-28 10:44
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===under info was translated buy computer, please contact the info poster===

By a, B two parts liquid group composition, with 1:1 weight ratio or volume than in the fully mixed, mixed liquid will curing is a soft elastic body, cured at room temperature or high temperature accelerate the curing, suitable for the encapsulation of electronic products, such as: the power, connectors, sensors, etc., solar photovoltaic module junction box of thermally conductive potting.
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