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Polyphenylene ether resins (PPO) are widely used in the manufacture of copper-clad laminates (CCL) and printed circuit boards (PCB), mainly due to their excellent insulating properties, heat resistance and mechanical strength. PPO resins not only improve the dielectric and mechanical properties of CCLs, but also enhance their dimensional stability and low water absorption.
Application of Polyphenylene Ether Resin in Copper Clad Laminate and Its Advantages
The application of polyphenylene ether resin in copper-clad laminates is mainly reflected in its excellent performance:
Insulation performance: Polyphenylene ether resin has low dielectric constant and dielectric loss, which can effectively reduce the interference and loss in signal transmission.
Mechanical properties: the modified PPE resin can significantly improve the mechanical strength and dimensional stability of copper-clad laminates, ensuring stable performance in high-frequency applications.
Thermal performance: Polyphenylene ether resins can maintain stable performance at high temperatures, which is suitable for high-frequency copper-clad laminates.